Electronic Packaging

Advanced Routing of Electronic Modules explores the fundamental theory and advanced technologies for improving routing. With descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed ..

Air Cooling Technology for Electronic Equipment answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses that are jargon-free and easy to understand, it covers theoretical, numerical, and experimental analyses, includes detailed descriptions of 12 air..

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various task..

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. This book examines the principal failure mechanisms associated with modern integrated circuits and descri..

Now in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete gui..

This book provides a sound scientific basis for achieving system operation without reliability penalties at realistic steady state temperatures. From a physics-of-failure perspective, it explores the temperature effects on electrical parameters of both bipolar and MOSFET devices, identifies models f..

Purposefully organized in independent chapters, the book systematically presents the widest possible overview of packaging knowledge. It illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-pac..

In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation, sh..

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve op..

Microsystems technologies have found their way into an impressive variety of applications, from mobile phones and displays to smart grids and electric cars. This book explores the state of the art and the applications of microelectronics technologies. It covers a wide range of topics, including orga..

Microsystems technologies have found their way into an impressive variety of applications, from mobile phones and displays to smart grids and electric cars. This book explores the state of the art and the applications of microelectronics technologies. It covers a wide range of topics, including orga..

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. As the demand for smaller, faster, and lighter products continues, electronic packaging includes a widening range of evolving topics and technologies. The Electronic Packaging Handb..